ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,490,162, issued on Dec. 2, was assigned to RAKUTEN MOBILE INC. (Tokyo). "Network management apparatus and network management method" was invente... Read More
ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,010, issued on Dec. 2, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo). "Substrate processing apparatus and method of manufacturing semicondu... Read More
ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,055, issued on Dec. 2, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan). "Semiconductor device and method for making the same" wa... Read More
ALEXANDRIA, Va., Dec. 2 -- United States Patent no. D1,103,886, issued on Dec. 2, was assigned to Guangdong GEERTOP Outdoor Gear Co. Ltd. (Dongguan, China). "Car awning" was invented by Shiyun Liu (D... Read More
ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,488,665, issued on Dec. 2, was assigned to Se-Kure Controls Inc. (Franklin Park, Ill.). "Tethering system for portable article" was invented by ... Read More
ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,529, issued on Dec. 2, was assigned to ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY (Scottsdale, Ariz.). "Two-dimensional ... Read More
ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,235, issued on Dec. 2, was assigned to KYOCERA Corp. (Kyoto, Japan). "Connector and electronic device" was invented by Yousuke Manba (Yokoha... Read More
ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,487,618, issued on Dec. 2, was assigned to NXP B.V. (Eindhoven, Netherlands). "Hybrid LDO regulator with fine loop preset" was invented by Minwe... Read More
ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,485,004, issued on Dec. 2, was assigned to Medtronic Inc. (Minneapolis). "Stents for prosthetic heart valves" was invented by Gianfranco M. Pell... Read More
ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,083, issued on Dec. 2, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "3D laminated chip, and semiconductor package i... Read More